An Overview of High Density Interconnect PCB Market

The HDI technology used in printed circuit boards is growing at a rapid speed. The global high density interconnect PCB market share is likely to reach $22,258.8 million by 2025. The Asia-Pacific region will occupy a huge segment of the market with a CAGR of 10.1%.

HDI PCBs have an increased wiring density than standard circuit boards. The HDI PCBs have more compact lines and spaces, along with miniaturized capture pads and vias. They are widely applicable in the consumer electronics sector and are gradually becoming popular in the automotive industry.

The 4-6 layers of HDI PCBs will witness huge growth because of the booming demand in the smartphone, datacom, and telecom industries. With the rising demand for wearables and connected devices, the 10+ layer HDI PCBs are becoming immensely popular. Dive into the market report to understand the standing of HDI PCBs in current times.

Factors Impacting the HDI PCB Market

High Density Interconnect PCB

A high density interconnect PCB has multiple benefits, including improved signal integrity. Learn about the top factors that have a massive impact on the HDI printed circuit board industry.

● Lower Weight and Miniaturized Layouts

The high density interconnect layout ensures that more components can be accommodated on both sides of the printed circuit boards. The decreasing size does not compromise functionality and instead makes it more efficient. The HDI PCBs can also expand the potential of products or equipment into which they are incorporated.

Due to the reduced size of the latest printed circuit boards, the weight of products in which they are used is also becoming less. The boards are extensively used in widely utilized communication devices like tablets and smartphones. As these products are small and need to offer exceptional functionality within limited space, the lightweight is a true blessing.

The demand for better power performance is increasing in the consumer electronics industry. But users are also looking for larger color displays with larger battery space. It leaves little room for printed circuit boards in the devices, leading to the growth of the HDI market.

● Improved Efficiency

The higher efficiency of the modern circuit board technology drives the growth of the high density interconnect PCB market. The high density interconnect layout ensures that the PCBs need minimal materials. With lesser boards and materials involved in the manufacturing process, the HDI layouts perform better than the standard PCBs.

Manufacturing the HDI PCBs also requires less time. Comparatively, the standard PCBs need a longer time to be manufactured. Therefore, the faster production of high density interconnect printed circuit boards also contribute to their popularity.

● Increased Use of HDI Technology in Automobiles

In the automobile industry, there’s a rising trend toward safety systems, miniaturized electronic devices, and autonomous driving. It is contributing to the growth of the global high density interconnect market. The advent of 5G and connected cars will further propel the growth of the HDI PCB market.

GPS navigation systems in cars also incorporate HDI PCBs. In fact, they are also found in the entertainment systems inside vehicles. The advanced driver assistance systems also need miniaturized circuit boards and will offer lucrative growth opportunities to the HDI PCB market.

● High Sales of Consumer Electronics

The rising sales of consumer electronics have a significant role in the increasing demand for the high density interconnect PCB. The consumer electronics sector is an extensive end-user market for high density interconnect boards. Currently, it is found in consumer electronic devices like smart wearables, smartphones, tablets, gaming consoles, and more.

● Top-Notch Manufacturing Process

Manufacturing high density interconnect printed circuit boards demand special methods like laser direct imaging. It is a fabrication process to aid the construction of refined lines on the circuit board. Besides the fine lines, tighter spacing among the components also make LDI necessary during the manufacturing process.

The expense of the overall LDI machinery equipment and equipment is quite higher than standard PCBs. Any individual operating the HDIs or constructing them will need specialized knowledge and intense training. Since the manufacturing process involves sufficient care, the products are top-notch.

Segmentation of the High Density Interconnect PCB Market

End UserAutomotive Consumer Electronics Industrial Electronics IT and Telecommunications
ApplicationSmartphones and tabletsSmart wearables PC and laptops
RegionAsia-Pacific North AmericaE uropeLAMEA (Latin America, Middle East, Africa)
Top Market PlayersDAP Corporation TTM Technologies Unimicron Unitech PCB Tripod Technology Ibiden CO., LTD.Rayming Technology CO., LTD.

The HDI PCB market can be divided into multiple segments. The high density interconnect PCB market size of the consumer electronics segment is the highest. The industrial electronics segment also shows a high potential for growth due to the increased use of automation.

Among applications, HDI PCBs are widely used in smartphones and tablets. With the escalating usage of tablets and smartphones in the industry, HDI PCBs have massive growth potential in this area. In recent times, high density interconnect boards are also widely used in smart wearables.

The Asia-Pacific region occupies the highest market share in the industry. The major consumers of the high density interconnect boards in this region include China, Japan, India, South Korea, and Taiwan. The presence of large electronic device manufacturers can be attributed to the high demand for HDI PCBs.

But the LAMEA region is also growing in popularity due to the high demand for HDI boards. The rising demand for cellular phones in the area is opening doors to the high density interconnect PCB industry. North America and Europe also have a demand surge for HDI PCBs.

The prominent players in the PCB industry include companies like TTM Technologies and Unimicron. They have adopted various market strategies to develop an edge over others. They have gained popularity via numerous partnerships, collaborations, expansions, joint ventures, mergers, acquisitions, etc.

Final Thoughts

The high density interconnect market has a bright future in multiple industries. As the demand for small and lightweight boards increases, the HDI PCB layout will emerge victorious at an unparalleled speed.